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EV Group's new EVG850TB Bonding System selected by Major Austrian Semiconductor Maker for High-Volume, Ultra-Thin Wafer Processing

EV Group, a leading supplier of wafer bonding and thin-wafer processing equipment for advanced semiconductors, MEMS and nanotechnology, has announced that a major Austrian semiconductor manufacturer has selected and installed an EVG850TB fully automated temporary bonding system for high-volume processing of thin- and ultra-thin device wafers.

Posted: Oct 14th, 2007

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Nanion Technologies nominated for German Future Award 2007

The planar patch clamp technology used in a family of automated electrophysiology products developed and marketed by Nanion Technologies GmbH in Munich, Germany, is among four technological and scientific innovations that have been nominated for this year's Deutscher Zukunftspreis (German Future Award).

Posted: Oct 14th, 2007

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Advanced Nanotechnology Sales Surge

Advanced Nanotechnology Ltd reports sales to customers for the September 2007 quarter were $960,000, up 102pc from $474,000 in the June 2007 quarter and up 188pc from $333,000 in the September 2006 quarter.

Posted: Oct 11th, 2007

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BIND Biosciences, Inc. Receives $2M NIST ATP Award to Develop a High-Throughput Platform for Targeted Nanoparticle Engineering

BIND Biosciences, Inc., a privately held biopharmaceutical company developing therapeutic targeted nanoparticles, announced today that it has received a three year $2,000,000 award from the U.S. National Institutes of Standards and Technology (NIST) under its Advanced Technology Program (ATP) to further develop its platform for high-throughput formulation and selection of targeted nanoparticles.

Posted: Oct 11th, 2007

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