DENSsolutions now introduces the 3rd generation of the FIB stub which enables you to prepare a lamella and place it directly on your chip, all inside the FIB.

The sample is located on an additional flat side of the stub. This ensures a conventional geometry and the very same and the well-known process used by any FIB operator.

Reduced shadowing improves the imaging quality, especially at low accelerating voltages during final milling and polishing steps (1-5 kV). The charging is also minimized further improving the quality of the images and the samples.

Due to a dedicated pocket for the Nano-Chips with an integrated end-stop and a smart clamp mechanism, loading and unloading of the chip becomes a simple and a fast process.

There is no need to use sticky tapes to fix the chip and the possibility to damage the fragile window membranes when handling the chips is greatly reduced.

The stub is engineered in such a way that the position of the sample and the Nano-Chip are on the same height (green dotted line). This minimizes the possibility of crashing into the pole piece, the gas Injection system or the manipulator

The FIB stub is compatible with Thermo Fisher Scientific/FEI and JEOL focused ion beam microscopes. For compatibility with Zeiss, Tescan and Hitachi FIBs, please contact us.

The FIB stub can be used with all double tilt (Wildfire/Lightning) heating and/or biasing TFS/ FEI or JEOL Nano-Chips.