Park Systems, a leading manufacturer of atomic force microscopy (AFM) products, announces the debut of Park XE15, a powerfully versatile atomic force microscope featuring a unique MultiSample scan. This newly developed large sample AFM provides researchers and operators with the ability to automatically image and measure up to nine individual samples.
ZEISS will be presenting the first system of the new Crossbeam series at the MC 2013 in Regensburg, Germany. Its outstanding features include high speed in materials analysis and processing and its wide diversity of applications. Time intensive 3D experiments that used to run for several days can now be completed overnight.
3M announces the launch of a new touch sensor film, 3M Patterned Silver Nanowire Film, that combines the expertise of two leading technology and manufacturing companies to provide the quality, unique attributes, and volume that touch screen manufacturers demand.
FlexTech Alliance today announced two R+D awards to Soligie of Savage, Minn. The intent of the awards is to advance flexible, printed electronics manufacturing and obtain delivery of innovative project demonstrators in 2014.
BIND Therapeutics, Inc., a clinical-stage nanomedicine platform company developing targeted and programmable therapeutics called Accurins, announced today that it has amended its development and commercialization collaboration agreement with Amgen Inc. to extend the period during which Amgen may exercise its option by six months.
Optofluidics announced the availability of a novel nanoparticle analysis and manipulation system called the NanoTweezer. The new system captures, manipulates, and analyzes individual nanoscale objects in high numbers including proteins aggregates, viruses, bacteria, and inorganic nanoparticles.
The Andor board last night agreed a 525p a share offer, giving a 31 per cent premium over the closing price before Oxford's initial 500p a share pitch in November. This values the deal at GBP 176 million.
Bruker Corporation today announced that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect substrates in multi-chip modules over previous generation SP models used by the semiconductor packaging industry.